Core i5-3230M i5 3230M SR0WY 2.6 GHz Dual-Core Quad-Thread CPU Processor 3M 35W Socket G2 / rPGA988B | Электронные компоненты и

Core i5-3230M i5 3230M SR0WY 2.6 GHz Dual-Core Quad-Thread CPU Processor 3M 35W Socket G2 / rPGA988B | Электронные компоненты и

Core i5-3230M i5 3230M SR0WY 2.6 GHz Dual-Core Quad-Thread CPU Processor 3M 35W Socket G2 / rPGA988B

This listing is for i5-3230M i5 3230M SR0WY. It's removed from new motherboard, no anyone used it before. And it is 100% tested in professional factory and make sure can work good and normally, then we can send to customers. The quality is excellent! And we can offer 1 year Warranty!!!!!! 1 year Warranty!!!!!! 1 year Warranty!!!!!! 1 year Warranty!!!!!! 1 year Warranty!!!!!! So, for the quality, you can 100% trsut us, no need worry! General information: Type: CPU / Microprocessor Market segment: Mobile Family: Core i5 Mobile Model number:i5-3230M CPU part number: AW8063801208001 is an OEM/tray microprocessor Frequency: 2600 MHz Maximum turbo frequency 3200 MHz (1 core) 3000 MHz (2 cores) Bus speed: 5 GT/s DMI Clock multiplier: 26 Package: 988-pin micro-PGA (rPGA988B) Socket: Socket G2 / rPGA988B Size 1.48" x 1.48" / 3.75cm x 3.75cm Introduction date January 20, 2013 S-spec numbers Part number ES/QS processors Production processors QD6E SR0WY AW8063801208001 + + Architecture / Microarchitecture: Microarchitecture: Ivy Bridge Processor core: Ivy Bridge Core steppings: E1 (QD6E) L1 (SR0WY) CPUID: 306A9 (QD6E, SR0WY) Manufacturing process: 0.022 micron Data width: 64 bit The number of CPU cores: 2 The number of threads: 4 Floating Point Unit: Integrated Level 1 cache size: 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches Level 2 cache size: 2 x 256 KB 8-way set associative caches Level 3 cache size: 3 MB 12-way set associative shared cache Physical memory 32 GB Multiprocessing: Not supported Extensions and Technologies MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions F16C / 16-bit Floating-Point conversion instructions EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit HT / Hyper-Threading technology ? TBT 2.0 / Turbo Boost technology 2.0 VT-x / Virtualization technology VT-d / Virtualization for directed I/O Low power features Enhanced SpeedStep technology Integrated peripherals / components: Integrated graphics: GPU Type: HD 4000 Graphics tier: GT2 Microarchitecture: Gen 7 Execution units: 16 Base frequency (MHz): 650 Maximum frequency (MHz): 1100 The number of supported displays: 3 Memory controller: The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1333, DDR3-1600, DDR3L-1333, DDR3L-1600, DDR3L-RS 1333, DDR3L-RS 1600 Maximum memory bandwidth (GB/s): 25.6 Other peripherals Direct Media Interface 2.0 PCI Express 3.0 interface Electrical / Thermal parameters Maximum operating temperature: 105°C Thermal Design Power: 35 Watt

Dear Buyers, Please pay attention to the following instruction upon receipt our chips The BGA chips you buy from our company are of high technology and as precise as nanometer. For small quantity of chips, they are exposed to the air after being taken out from package. So they probably will adhere to some humidity. Thus, in order to avoid quality problem, we suggest that you put them inside a baking chamber for at least 24 hours at 100℃-110℃。 When soldering, please control the temprature precisely. Lead-Free/No Pb BGA chips is 245℃--260℃ (Maximum) Leaded/Pb BGA chips 180℃--205℃ (Maximum). The soldering process is complicated. Soldering/replacing chips must be operated by engineers who have proficient skills. As BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control, or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering. The chips will, as a result, die. BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points: 1) Have you bought the right chips? 2) Do you have proper equipment? 3) Are you skillful enough to solder the chips?

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