1pcsx5g Thermal Pads Conductive Heatsink Plaster Viscous Adhesive Glue For Chip VGA RAM LED IC cooler radiator cooling | Инструменты

1pcsx5g Thermal Pads Conductive Heatsink Plaster Viscous Adhesive Glue For Chip VGA RAM LED IC cooler radiator cooling | Инструменты

Features :

Condition:100% New

Package:1pcs/lot
Scope of application:
With high strength, fast bonding effect, suitable for direct bonding of various types of components, LED and cooling devices, etc.)
Packaging air tightness, jacket vacuum bag isolated air, increase the storage time.
Product performance:
 
Good thermal conductivity, strong adhesion and vacuum packaging is not easy to oxidize dry sticky dry good drying time short performance is very good recommended a variety of chip cooling use
Good thermal conductivity and insulation of the one-component room temperature vulcanized silica gel, the product has good conductivity, wide use of temperature range (-60 ~ 200 ℃), short-term resistance to 300 ℃ high temperature. In addition, it has the advantages of short surface curing time, strong cohesion, long storage period, non-toxic and solvent-free, and can be used in elastic bonding, heat dissipation, insulation and packaging in electronics, electrical appliances, instrumentation, LED, heat sink and other industries.
Instructions:
1, when used directly to the product extrusion, rub and sticky surface, immediately covered with a ready to try again;
2, the surface fixed speed and the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3, the proposed smear thickness: 0.1-0.5mm, the thinner the better.
4, before the use of the surface of the adhesive should be used to clean the solvent (such as alcohol), should not use detergent to clean, until the surface clean before smearing.

Melting amount: 0 (200 ℃ / 24Hours)
Evaporation: 0.001% (200 ℃ / 24Hours)
Thermal conductivity:> 0.671W / m-K
Thermal Impedance: <0.06
Solidification time: 3min (25 ℃)
Building strength: 25Kg
Insulation Coefficient> 5.1
Dissipation factor <0.005
Maximum withstand temperature 200 (℃)

1. Thermal properties, strong adhesion.

2. Thermal conductivity: > 0.671W/m-K Thermal

3. Net Weight: 5g

4. Strength of connected buildings:1.5map

Note: it is has strong viscous ability ,can't removal after it was getting solid. don't recommand to use it in your CPU and GPU processor.