Spartan-6 High Speed Development Xilinx XC6SLX45T 4Gbit DDR3 PCIe SATA | Инструменты

Spartan-6 High Speed Development Xilinx XC6SLX45T 4Gbit DDR3 PCIe SATA | Инструменты

modname=ckeditor 5VI Spartan-6 LXTHigh-speed Connection Function Development Kit Based onGV Spartan-6 LXT CXS6T150Core board andBXS6T02On the basis of high-speed connection function floor,Containing developmentPCle, SATAIAnd the hardware necessary for high-speed connection applications,Software andIPnucleus。GVIAt the same time, it also provides an extended application model suitable for the suite.。   The suite contains: GVI Spartan-6 LXT OXS6T150-45Core board。
BXS6T02High Speed Connection Function Baseboard。
5V@2APower Supply。
Reference Design、Design examples and demonstration files
Technical documentation,Provide buckle plate(pdiformat)Bottom plate schematic(pdformat) ; At the same time, it will provide a reference to cooperate with the core board.pcb (Not the delivery floorpcb) ,thispcbMainly to provide customers with core board connector positioning,Convenient secondary development。       CXS6T150Core Plate Characteristic Parameters(FPGAModel: XC6SLX45T-CSG324-Grade3)   1.High Performancexinx Spartan-6 LXT FPGA,OptionalLX25TandLX45T, Spartan-6 LXT FPGAThe advantage is to make use of special purpose.3.2 Gbps GTPTransceiver and integratedPCI ExpressEndpoint Module Realizes Low Power Serial Connection Function。
2.16position1GBit (128MByte)Memory granules(achoose4GBit (512MBytel)。Memory Access Width: 12.8Gbps @400MHz。
3.128 MBit (16 MByte) SPI Flash memory。
4.Connector:3High density(0.5 mm) HiroseHigh Performance ConnectorDF12(3.0)-50DS-0.5V(86) ,
5.B2BConnector10:Up to39Differential signal, 78Single-ended signals
6.3.2Gbps GTPtransceiver: LX45T 4group, LX25T 2group
7.PCIE Endpoint Block: 1
8.50MHzActive crystal oscillator
9.LEDBreathing lamp(It can also be used as a general purpose.LEDUse)
10.FPGAYou can configure it in the following ways  B2BConnector.
JTAGport
SPI Flash memory 11.high efficiencyDC-DCSwitching power module
o 1.2V@3A
o 2.5V@ЗA
o 1.5V@1A.
12.Button plate power supply: 3.3V
13.Ultra-compact design: 3.5cm x 3.0cm     BXS6T02Characteristic parameters of floor 1.compatibleCXS6T150Series Core Board。
2.6APower module,Use1Company'sTPS54610Switching power supply chip。
3.OnePCI Express x1Edge connector。
4.3individual SATAConnector
5.2individualSMAConnector,Can be used to connect external clock signals。
6.3High density(0.5 mm) HiroseHigh Performance ConnectorDF12(3.0)-50DS-0.5V(86)
7.Encryption chipDS2432:Internal integration1024positionEEPROM, 64Bit key、One8Byte registers/Control Page(It contains five user reads and writes sections)、512positionSHA-1Engine and a full-featured1-WireInterface.
8.USB <-> UART
9.3individualFFCHigh Speed Extension Interface,provide36Differential signal,74Single-ended signals
10.2.54mmInsertion needle,provide54Single-ended signals(andFFCInterface multiplexing signal)
11.14needleJTAGInterface
12.2A coincidencePCIEStandard Fixed Hole,Can be used to fix the chassis baffle(Semi-high or full-high plate) .
13.6APower module,UseTCompany'sTPS54610Switching power supply chip
14.Power input:5V
15.plate size: 10cm x 6.9cm

Brief introduction of CD-ROM